Harminder Singh
Sr Packaging R & d Engineer at Intel Corporation
Based in Avondale, United States
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Seniority
Staff
Department
Engineering
Location
Avondale
Industry
Semiconductor Manufacturing
Company size
110K
Contact information
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h•••••••@intel.com
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Background
About Harminder Singh
Global Process and Equipment Engineering support to almost all Major semiconductor companies in US- 300mm fab strat up with immersion scanners - Traveled to ASIA to support critical escalations and new tools/Demo lab support- ASML sales support for options. Specialties: 2nd line application engineers for almost 10 years. with Extensive knowledge of PAS5500/XT, dry and immersion scanners in aligment,focus,overlay and lens heating.
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