Harry Hicks

Background

About Harry Hicks

I'm an RF engineer at Teledyne Lincoln microwave, to get to this position I completed a three-year apprenticeship at Teledyne and within this time I achieved my HNC and HND in electrical and electronic engineering, in addition to this, I also completed an NVQ level 3 in electrical maintenance. During my time at Teledyne, I've had the opportunity to work with various different devices for example RF limiters, circulators, and RF switches. I've also been exposed to various different equipment such as VNA's, Oscilloscopes, and magnetrons, additionally I have experience in mechanical design and 3D printing through the use of Autodesk inventor and a form labs 3D printer. Furthermore, I have experience with designing RF boards through AutoCAD with then manufacturing them through the use of an LPKF machine. This has meant I have had to deal with sensitive components which are small and need to be handled with care, this has given me a steady hand and increased my soldering and handling capabilities. I have no other industrial experience apart from my time at Teledyne since previously I was in full-time education.