Jack Lin
Ic Package Design Manager at Molex
Based in Taiwan
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Seniority
Manager
Department
Engineering
Location
Taiwan
Industry
Appliances; Electrical; and Electronics Manufacturing
Company size
14K
Contact information
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j•••••••@molex.com
Phone
5 credits+886 ••• •••• ••••
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Background
About Jack Lin
o Industry experience on flip chip, 2.5D/3D IC, power module packaging and embedded…
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