Jack Rumptz
Process Engineer at Intel
Based in Portland, United States
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Seniority
Staff
Department
Engineering
Location
Portland
Industry
Semiconductor Manufacturing
Company size
110K
Contact information
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j•••••••@intel.com
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Background
About Jack Rumptz
Module engineer at Intel working on the deposition of metal thin films to enable the miniaturization of devices and mass production of integrated circuits. I am a highly motivated chemical engineer who excels at solving complex technical problems. I am passionate about applying engineering principles to enhance process efficiency and improve yield. I thrive when working closely with a team while also being self-motivated and capable of tackling challenges on my own. Graduated with my PhD in chemical engineering from the University of Washington in the group of Charles T. Campbell. My research focused on the interfacial interactions of metal nanoparticles supported on single crystal materials.
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