Jan Reichelt

Front-end Engineer at Tekscend Photomask Formerly Toppan Photomask

Based in Dresden, Germany

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Seniority

Staff

Department

Information Technology

Location

Dresden

Industry

Semiconductor Manufacturing

Company size

149

Contact information

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Email

1 credit

j•••••••@photomask.com

Phone

5 credits

+49 ••• •••• ••••

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Background

About Jan Reichelt

Life Data Analysis LDA, Systems Reliability BlockSims (2006) Accelerated Life Time Analysis ALTA (2006) Reliability & Maintainability of Repairable Systems (2009) Design-for-Reliability (2009) Reliability Growth Analysis, Physics-of-Failure (2006) Design-of-Experiement CEDA / Cornerstone (2006) Lean Manufacturing & Factory Physics Basis (2007) FMEA (Failure Mode and Effects Analysis - 2004) Statistical Process Control (SPC) Problem Solving (ATS/8D)(2007) Project Management (Level I - 2007) Successfull Presentation (2007) Specialties: Material behaviour under dynamic and thermo-mechanical load, material & assembly characterisation, Integration of FEA and experiment for virtual life time prediction, reliability of components & systems, accelerated test methodology, failure mode assessment, preventive reliability management, modern mounting techniques within micro-electronic like Flip Chip, Ball Grid Array, Wafer Level Package, 3D-Chip (TSV), high-temperature electronic assemblies.

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