Jaylen Cheng
Smts Product Development Eng at Amd
Based in Taiwan
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Seniority
Other
Department
Other
Location
Taiwan
Industry
Semiconductor Manufacturing
Company size
62K
Contact information
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j•••••••@amd.com
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Background
About Jaylen Cheng
Thermal Engineering Leader | Advanced Cooling Solutions | OCP Contributor Over 10 years of experience in thermal and energy technology development, specialized in developing advanced cooling solutions for high-performance computing (HPC), AI servers, and data centers. Expertise includes liquid cooling, 2-phase immersion cooling, and air-cooling thermal solutions, driving efficiency and sustainability in next-generation thermal designs. • Developed liquid cooling solutions for high-density AI racks, including AALC and L2L solutions, showcased through live demonstrations at the OCP Global Summit. • Developed 2-phase immersion cooling solutions for AI and HPC servers, optimizing thermal performance and energy efficiency. • Engineered high-performance coolers, including water cold plates, two-phase cold plates, and 2-phase boilers. • Contributed to key industry whitepapers, including the OCP OAI Liquid Cooling Design Guide. With a background in Applied Mechanics (M.S, NTU) and Mechanical Engineering (B.S, NCU), along with experience at ITRI and Delta Electronics, consistently driving innovation in thermal management, system validation, and sustainable cooling solutions.
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