Jitendra Narayan Panda

Background

About Jitendra Narayan Panda

o I have 10 years of industrial and non-industrial work experience in the field of concept development, product development followed by commercialization. o Upstream/ downstream process engineering for Polymer composite, blend, Adhesives, compounding, films, tubes, rods using advanced manufacturing techniques, o 1 year of experience in corrosion and 3 years of collaborative experience in oil and grease lubricant development. Hands-on experience on Injection molding, Sheet extrusion, Compounding, Blow molding, Blown film extrusion process and optimization using DOE. Intellectual property development, Raw material procurement and management, Data analysis, Project management, team management, Customer support management, Quality management system (ISO 14001:2015, ISO 17025:2017 ) expertise Skilled Engineer with a background in Polymer/plastics, currently working in the development of biodegradable and sustainable resins for injection molded containers, blown films, thermoformed products and blow molded containers for the potential replacement of traditional plastics. Design and analysis of products using Solid works, Inventor, ProE, Ansys FEA etc. I developed many of the skills and foundational knowledge which include polymer adhesives and coating of epoxy and PEEK, preparation, processing and rheology of polymer matrix composites (thermoplastics and thermosets) manufactured through injection moulding, compression moulding, extrusion (compounding), layup, pultrusion, autoclave, resin transfer moulding, filament winding, Automatic fiber placement (AFP) etc. I had the opportunity to develop both hands-on and theoretical knowledge on multiple characterization techniques (Mechanical, thermal, rheological), typically used to examine polymer and composite materials, including X-ray photoelectron spectroscopy (XPS), Raman Spectroscopy, X-ray tomography, X-ray diffraction (XRD), 3D profilometry, scanning electron microscopy (SEM), Optical microscopy, FTIR, NMR, DSC, TGA, DMA, HDT, thermal conductivity, particle size analyzer by DLS and mechanical testing, etc.