John Bussan

Engineer 5 at Lam Research

Based in Evanston, United States

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Seniority

Staff

Department

Engineering

Location

Evanston

Industry

Semiconductor Manufacturing

Company size

16K

Contact information

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Email

1 credit

j•••••••@lamresearch.com

Phone

5 credits

+1 ••• •••• ••••

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Background

About John Bussan

I'm an innovative, highly experienced design engineer and engineering manager. I have leading-edge experience designing and managing in complex development environments over a wide range of state-of-the-art electromechanical products, and am an inventor on seven US and international patents. I'm skilled at building and improving engineering departments and documentation systems to produce profitable, easily manufactured products in response to challenging requirements. I'm very adept at working with marketing teams to develop technical products that can be designed and built on schedule, from initial market specification through manufacturing. Products I've designed, modified and managed have included a NASA sounding rocket's dark matter Xray camera payload, the rotating Half Wave Plate for a very large ground-based telescope, medical infusion pumps, AFM-based dip pen nanolithography machines, nanoimprint lithography machines, extremely accurate surface and pen leveling subsystems, extremely flat polymer pen arrays, high throughput anti-counterfeit nanoencryption machines, calorimeters, semiconductor wafer polishing machines, wafer laser inspection machines, laser via drilling machines, laser trimmers, dark field laser inspection subsystems, high-speed pick and place robots, computer hard drives and computer printers. I have hands-on, in-depth knowledge of Solidworks, Inventor, commercial motion controllers, rotary step and servo motors, linear motors, voice coils, piezo actuators, flexures, nanopositioners, high-sensitivity load cells, high speed resistor measurement systems, galvanometers, FEA, optical mechanics, microprocessor architecture, sensors, Eccosorb filter molding, assembly/C/ Python programming, PCB design, CNC/waterjet/laser machining, additive manufacturing, rapid prototyping, injection molding, polyurethane molding, thermoforming, plating, anodizing and finishing processes.

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