John Conley
Professor at Oregon State University
Based in Corvallis, United States
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Seniority
Staff
Department
Education
Location
Corvallis
Industry
Higher Education
Company size
14K
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j•••••••@oregonstate.edu
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Background
About John Conley
Current research interests include atomic layer deposition (ALD), metal/insulator/metal devices (MIM & MIIM tunnel diodes, MIM high-κ capacitors, and RRAM), internal photoemission (IPE), thin film transistors, nanomaterials, sensors, and electron spin resonance (ESR) identification of electrically active point defects in novel materials. Authored or co-authored over 120 technical papers, over 130 additional conference presentations (including tutorial short courses on high-k dielectrics and 15 invited talks), and 20 U.S. patents, which together have received more than 2,800 citations. Fellow of the Institute of Electrical and Electronics Engineers and American Vacuum Society (AVS). Earned BSEE in 1991 and Ph.D. ESM in 1995 from The Pennsylvania State University where he won a 1996 Xerox Prize for his Ph.D. dissertation. He was at DRC from 1995 to and at JPL from where he received an achievement award. In 2001, he became a senior member of the technical staff at SLA and from 2005-2007 was Leader of the Novel Materials and Devices Group. In 2002-03, he served as an adjunct professor at the Vancouver campus of Washington State University. Since 2007 he has been at OSU where is a Professor in both the School of Electrical Engineering and Computer Science as well as the Intercollege Materials Science Program, an ONAMI Signature Faculty Fellow, and co-Director of the Materials Synthesis and Characterization (MASC) facility. Dr. Conley is an Associate Editor of Transactions on Electron Devices and has served as a guest editor for three special issues of Transactions on Device and Material Reliability and has served on the technical and management committees of the American Vacuum Society, the MRS Electronic Materials Conference, Nano, IRPS, the SOI Conference, and the Nuclear and Space Radiation Effects Conference, was technical program chair of the 2017 AVS International Atomic Layer Deposition Conference, the Microelectronics Reliability and Qualification Workshop, and general program chair of the International Integrated Reliability Workshop.
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