Ken Wang
Mfg Integration at Ayar Labs
Based in United States
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Seniority
Staff
Department
Manufacturing & Production
Location
United States
Industry
Computer Hardware Manufacturing
Company size
257
Contact information
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k•••••••@ayarlabs.com
Phone
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Background
About Ken Wang
Resourceful and analytical engineer with extensive expertise in development and execution of the complex hybrid wire bond and flip chip, mono and heterogeneous 2.5D/3D packaging integration. With solid program management background.Specialties: IC packaging and Assembly, BGA, LBGA, FCBGA, SiP, Stacked Die, micro Modules, Automotive QFN/DFN, optical sensor
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