Kimberly Jardin
Senior Engineer, Npi Back-end Technology Quality at Ampleon
Based in Calabarzon, Philippines
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Seniority
Staff
Department
Other
Location
Calabarzon
Industry
Semiconductors
Company size
834
Contact information
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k•••••••@ampleon.com
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Background
About Kimberly Jardin
As a current NPI Quality Engineer in Ampleon, I am responsible of the following- Implementing quality requirements per Product Creation Process for new package/technology and product introductions- Developing and implementing release and change control procedures for technical changes - Working with cross-functional program team to ensure that project deliverables are reviewed, published and documented by the required approving team- Leading CCB for review and approval process on identified changes - Collaborating with program and project teams to achieve quality goals- Leading quality inspectors for STR line - Working with corporate NTI/NPI team in improving our product creation process- Developing and implementing new processes to achieve proactive risk identification, mitigation and elimination at early stage of our product development process- Knowledgeable in assembly processes of the following packages in RF application: Overmolded Packages (OMPs), Air Cavity Ceramic (ACC), Air Cavity Package (ACP), GaN technology, LGA Other Affiliation- Current member of the Ampleon-Nexperia Toastmasters Club - Current club officer (Secretary for the year of 2020-2021) of the Ampleon-Nexperia Toastmasters Club - As a former Product/NPI Engineer in Amkor Technology Philippines, I am experienced in terms of the following: Project Management - Manage at maximum 9 customer accounts as a Product Engineer - Qualified and developed new products of different semiconductor customers- Designed and co-authored procedure for New Product Introduction (NPI)- Qualified device into High Volume Manufacturing (HVM) of one of the customers that turned Amkor Technology Philippines as the number 1 supplier. Technical - Knowledgeable in the entire semiconductor assembly process- Supported Wirebond Design of Experiment (DOE)- Supported Die Attach Process Improvement in terms of tooling improvement- Experienced in generating 8 Discipline (8D) report, Executive Summary Report (ESR), Assembly Workmanship Report System Skills - Microsoft Word, Powerpoint, and Excel - Lotus Notes, Microsoft Outlook, Product Lifecycle Management (PLM), Agile Leadership - My current job position is equivalent to Supervisory level- Team leader of the biggest customer in CABGA department- Managing people of four in my team- Aside from BGA/CABGA package, I am also knowledgeable and experienced in Cavity MEMS/MEMS package- Handled a laminate-to-laminate (L2L) package with ASIC and MEMS dies.
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