Lim Chong Sim

Background

About Lim Chong Sim

With a total of 15 + years of experience in packaging development, transfer and sustaining, I have seen the entire product cycle and has been instrumental in developing new packaging technologies for the flip chip molded matrix array package and the flip chip ball grid array package, transfer of technology and managing the key high volume manufacturing sustaining indicators. As a materials development engineer, I was instrumental in delivering new and innovative materials options (e.g. thermal conductive mold compound and die protection film) to enable next generation SoC technologies. In my most recent role, as a process equipment transfer manager, I was instrumental in establishing a standard for equipment source inspections and driving standardization of technology transfer to the factories. With 4 years in the management role, I am most passionate about people development and bringing out the best skills in them. As a PhD graduate in Materials Engineering, I am most passionate about product development and hold 2 patents, 3 trade secrets, 5 internal publications and 14 external publications in peer reviewed journals. Specialties: Materials development for electronics packaging, materials characterization and analysis, materials selection, roadmap generation, yield improvements, statistical analysis and materials qualification