Logan Alexander

Background

About Logan Alexander

As a mechanical engineer currently working at Lam Research, I’ve had the opportunity to dive deep into the fascinating world of semiconductor technology. My journey began with a strong foundation in mechanical engineering from Washington State University Vancouver and Clark College. Since then, I’ve spent nearly four years honing my skills in advanced technologies development at Lam Research. Every day presents new challenges, and I thrive on solving complex problems that push the boundaries of innovation. Before joining Lam Research, I worked at Rightline Equipment where I was fortunate enough to be part of a vertically integrated company that allowed me to explore hands-on design work. One of my proudest moments was bringing designs from concept through high-volume manufacturing, which taught me the importance of collaboration across teams and how critical it is to marry creativity with practical application. My early experiences as an intern and product designer helped shape my understanding of mechanical systems while also instilling a sense of teamwork that I carry with me today. Working as an Engineering Aide at Clark College was particularly rewarding; it not only reinforced my technical skills but also gave me the chance to mentor fellow students in statics and engineering sketching. Outside of engineering, I’ve learned invaluable lessons in communication and customer service during my time as a server at Lapellah Restaurant. Being a friendly face who makes people feel welcome taught me how important interpersonal skills are in any field—especially when collaborating on projects or presenting ideas. I’m excited about expanding my expertise within the semiconductor industry and am always open to connecting with others who share this passion. If you’re interested in discussing innovative engineering solutions or potential collaborations, feel free to reach out via email! Skills: Design & Analysis - CAD: PTC Creo, NX, Fusion 360 - GD & T (ASME Y14.5)- Finite Element Analysis (FEA): COMSOL - Computational Fluid Dynamics (CFD): COMSOL - Failure Mode and Effects Analysis (FMEA)- DfX: Design for Manufacturing, Cost, and Assembly - LEAN Design - Drawings: Technical Drawings, Assembly Drawings, Fabrication Drawings. Thermal, Fluid, and Mechanical Systems - Thermal Systems - Fluid and Gas Delivery - High Vacuum - High Pressure - Coatings and Material Selection - Machine Design Electronics - PCB Design - Circuit Analysis - PCB Integration - Electronics Prototyping - Wire Harness design and CAD routing