Logan Keating
Packaging R & d Engineer at Intel Corporation
Based in Savoy, United States
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Seniority
Staff
Department
Engineering
Location
Savoy
Industry
Semiconductor Manufacturing
Company size
110K
Contact information
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l•••••••@intel.com
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Background
About Logan Keating
I began my career as a music major, of all things! I got 90% of the way through a music performance degree at Indiana University, when I decided to change fields to chemistry. As I worked through my chemistry degree I realized that I wanted to be closer to the applications of my research, and I started to pursue a Ph.D. in Materials Science and Engineering at the University of Illinois at Urbana-Champaign. My Ph.D. research focused on the synthesis of colloidal nanorod heterostrucures, characterization of Quantum Dot LEDs, and improving/automating the laboratory synthetic apparatus. Through all of my projects, I have emphasized computation and programming as a way to solve problems, and I believe that science of the 21st century will be defined by how well we can integrated computation and automation into our workflows. After defending my Ph.D. I accepted a position with Intel as a Packaging Engineer. My greatest strength is that I greatly enjoy learning new things, which means that I'm constantly adding new tools to my arsenal which allow me to work more effectively, and cross disciplinary boundaries. Professionally, I love to drill down and find solutions to difficult problems. I really enjoy working with others to make impossible things possible.
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