Logan Santos
Staff (Mts) Advanced Packaging Engineer at Amd
Based in Austin, United States
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Seniority
Other
Department
Other
Location
Austin
Industry
Semiconductor Manufacturing
Company size
48K
Contact information
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l•••••••@amd.com
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Background
About Logan Santos
Senior Advanced Packaging Engineer with 13+ years of experience developing, qualifying, and ramping high‑performance semiconductor packages, including 2D/2.5D/3D, flip‑chip, WLCSP, and QFN technologies, for leading fabless semiconductor companies. Proven record of partnering with tier‑one global OSATs, substrate suppliers, and silicon fabs to deliver cost‑effective, manufacturable solutions from concept through high-volume production. Deep expertise in NPI/NTI, package technology development, supplier qualification, yield/capacity optimization, and cross‑functional technical leadership, with demonstrated multibillion‑dollar revenue impact.
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