Mark Anthony Gorospe

Background

About Mark Anthony Gorospe

I am a Package Development Engineer specializing in 3D modeling, IC package design, and simulation support. I focus on delivering high-quality, optimized packaging solutions by leveraging advanced tools such as SolidWorks, Cadence Allegro Package Designer (APD), AutoCAD, and Ansys.My knowledge includes:Designing complex package layouts in Cadence APD. Developing simulation-ready 3D models for performance analysis. Performing thermal simulations using Ansys to evaluate heat distribution and ensure thermal reliability. Creating standardized templates and advanced resource files to improve design consistency and efficiency. Executing comprehensive Design Rule Checks (DRC) to validate design accuracy. Streamlining workflows by integrating mechanical and electrical CAD tools across platforms. I’m passionate about innovation, continuous improvement, and cross-functional collaboration to meet design and manufacturing goals. I thrive in fast-paced engineering environments and am committed to delivering practical and effective design solutions.Let’s connect and collaborate!