Mark Brinkman

Embedded Design Engineer New Product Development at Lindsay Elecsys

Based in Lenexa, United States

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Seniority

Staff

Department

Other

Location

Lenexa

Industry

Appliances; Electrical; and Electronics Manufacturing

Company size

78

Contact information

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Email

1 credit

m•••••••@lindsay.com

Phone

5 credits

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Background

About Mark Brinkman

More than 25 years of embedded system, board and chip level design experience in M2M, IIOT, agriculture industrial, military and aviation applications including product conceptualization, requirement capturing/tracking and verification and validation. A great deal of experience in the area's of electronic development specifically, system on a module (SOM's), 8 to 32 bit CISC and ARM processor's, TI DSP's, cellular modems, IO interfaces, networks, bus topology and programmable logic. Other significant work has been in the design of GNSS modules, cellular modems, remote monitoring, low power devices, harsh environmental designs, sensitive signal conditioning, board level power supply and boot firmware development plus conceptual knowledge of RF principles and design techniques. Cradle to grave development and everywhere in between. Six sigma certified and past security clearances. Studies in software languages (including scripts), statistical analysis and design for manufacturing. Am interested in bringing my passion for embedded electronic development and quality to new and/or existing designs where I can be engaged, creative and produce. Specialties: System, board and chip level design, especially digital. Keen to all aspects of life cycle development i.e. requirements research and definition, prototyping, proof of concept, development, V&V and production transitioning.

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