Mark Forde

Background

About Mark Forde

With over 30 years of experience in the fields of wafer fab process engineering, quality and reliability engineering and operations, I am passionate about delivering innovative and reliable solutions for the semiconductor industry. I have a strong background in microelectronics, with a master's degree in engineering science and a bachelor's degree in electronic production. I also have a master's degree in business administration, and six sigma certification, which enables me to align quality engineering strategies with business objectives and customer needs. As a Senior Director of Quality and Reliability Engineering at Analog Devices, I have lead local and global teams of quality and reliability engineers who worked across quality engineering, quality systems, quality operations, new products and technology, systems and hardware development, reliability engineering, intrinsic reliability and failure analysis, supporting wafer fabrication, packaging and product development and engineering. I am driven by the mission of Analog Devices to create high-performance analog, mixed-signal, and digital signal processing products that advance the fields of healthcare, industrial, automotive, and communications. In my current role, I am responsible for Global Intrinsic Reliability of internal wafer fabs, external foundry, and backend packaging technologies as well as product de-risking for new products and legacy products, and resiliency qualifications. This involves developing team expertise for intrinsic device and packaging failure mechanisms covering silicon, wide band gap devices, sensors and packaging, including characterization and modeling, test development, system development, and aging simulation. I’m also leading site operations and part of the senior leadership team.