Mark Woods

Chip Packaging Engineer at Triquint Semiconductor Now Qorvo, Inc

Based in Dallas, United States

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Seniority

Staff

Department

Engineering

Location

Dallas

Industry

Semiconductor Manufacturing

Company size

717

Contact information

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Email

1 credit

m•••••••@qorvo.com

Phone

5 credits

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Background

About Mark Woods

I have 21 years of experience as a mechanical engineer, much of it focused in the area of product development, especially products related to heat transfer processes and cooling systems. I'm presently working on cooling high-powered MMIC chips. Prior to this, I spent eight years in thermoelectric technology working primarily on defense/space and photonics-related products. Hobbies include running marathons, snowboarding, weightlifting, and various sports. RESUME: Career Excerpts:

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