Michael Rosshirt
Yield Integration Engineer - Assembly Test Technology Development at Intel Corporation
Based in Chandler, United States
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Seniority
Staff
Department
Information Technology
Location
Chandler
Industry
Semiconductor Manufacturing
Company size
110K
Contact information
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m•••••••@intel.com
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Background
About Michael Rosshirt
Mechanical engineer specializing in developing next-generation semiconductor packaging technology (2 yrs.). Graduate academic background in heat transfer, fluid mechanics, and thermodynamics with experimental research experience in carbon-based nanotechnology (3 yrs.). An engineer by training but a physicist at heart with a passion for learning and creative problem solving. Interested in next-generation semiconductor technology and MEMS applications-based research in multidisciplinary environments. Specialties: Semiconductor Packaging and Test, MEMS, TIM, Design of Experiment, Model-Based Problem Solving, Statistical Data Analysis, Computational and Analytical Modeling, Lean Six Sigma, Carbon-Based Nanotechnology Programming Languages: Matlab, JSL, NI LabVIEW, Simulink, C#, PBASIC, Mathematica Software: JMP, ANSYS, SQL Pathfinder, Solid Works, Pro-E, AutoCAD, Star-CCM+, Star-Design, Microsoft Excel Graduate Coursework: Heat Transfer (Conduction, Convection. Radiation). Computational Fluid Dynamics, Viscous Flow, Gas Dynamics, Equilibrium Thermodynamics, Combustion Thermodynamics and Technology, Numerical Methods
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