Michael Senske
Chairman & CEO at Pearson Packaging Systems
Based in Spokane, United States
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Seniority
C-Team
Department
General Business & Management
Location
Spokane
Industry
Machinery Manufacturing
Company size
190
Contact information
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m•••••••@pearsonpkg.com
Phone
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Background
About Michael Senske
Mr. Senske joined Pearson Packaging Systems 1997. During his tenure at Pearson Packaging Systems, he has held a wide variety of positions including Product Manager, Director of Business Development, and Vice President Sales & Marketing. Mr. Senske assumed the role of President & CEO in 2005. Prior to working at Pearson Packaging Systems, he worked in the Product Support Services division of the Consumer Division Unit at Microsoft Corporation. Mr. Senske graduated with a Bachelor of Arts degree in Psychology from the University of Washington, and he is a graduate of Harvard Business School’s Owner/President Management Program. Mr. Senske serves on the board of directors for Colmac Holding Company as well as on the boards of the Association of Washington Business (past chair), The Washington Roundtable (Past Chair), and The Federal Reserve Bank of San Francisco - Seattle Branch.Specialties: Application of the principles of lean manufacturing to low-volume / high-variability environments, corporate strategy, corporate governance in privately held organizations, corporate succession
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