Michael Vincent Cometa

R & d Technical Lead at Intel Corporation

Based in Rochester, United States

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Seniority

Manager

Department

Other

Location

Rochester

Industry

Semiconductor Manufacturing

Company size

110K

Contact information

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Email

1 credit

m•••••••@intel.com

Phone

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Background

About Michael Vincent Cometa

Die Sort Probe Card Maintenance and Metrology. Head micro-surgeon • Area Coordinator to 12 other technicians • Team Lead on all technologies, tools, data applications and training. • Interim Engineering Technician since March 2020. Responsible for tool recovery, engineering project assistance and metrology calculations. • Extremely proficient in Probe replacement, troubleshooting and repairs. • Lead trainer for all prototype technologies. • Collects and evaluates operating data to conduct equipment adjustment and ensure process optimization. • Responsible for preventive maintenance, troubleshooting and sustaining. • Responsible for improvement processes, troubleshooting nonstandard events in the production line, and reviewing technological health and stability. • Intel certified peer trainer and Lead to new hires. • On-call Technician to Engineering team Key accomplishments at Intel: • Became leading technician in replaceable technologies. Gathered experience from neighboring modules, vendors, and engineers, then brought that knowledge back to my peers. • Serves as Engineering Technician while a replacement is found. Filling this void requires multitasking two roles while fulfilling manufacturing priorities. This initiative has resulted in many recognitions, company bonuses and awards sanctioned by the CEO. Management has not seen a reason to fill this role while I have taken over since March of 2020. • Implemented a role casting project mirroring a triage unit to boost productivity on our damaged products. Example: First Responder, Surgeon, Release Review…etc. This role ensures each damaged product coming down the process line receives individual attention until it is ready for the next technician. This process has resulted in fewer misses, fewer repair errors and decrease in down time.

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