Michelle Coyle
Packing R & d Engineer at Intel Corporation
Based in Phoenix, United States
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Seniority
Other
Department
Other
Location
Phoenix
Industry
Semiconductor Manufacturing
Company size
110K
Contact information
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m•••••••@intel.com
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Background
About Michelle Coyle
Research and development semiconductor packaging engineer with experience in tool selection, semiconductor technology and operations. My 4 years of semiconductor experience is complemented by my education in mechanical engineering from Carnegie Mellon University. My extensive studies and research in various national labs has well equipped me with the skills necessary to further the manufacturing sector of the semiconductor industry.
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