Mike Halpin

Background

About Mike Halpin

Manager and Tier1 deal maker at Intel Corp. who brings together Arch.’s, Planners, Ops, Finance, Intel Capital, Legal and Exec. Mgmt. to engage with partners and customers (incl. China, Japan, Europe, Israel, US, Mexico, Central and South America) to negotiate non-standard collaboration and ancillary agreements between Intel and companies (ex: co-develop SoC’s, boards, ref. designs, complete products, software stacks, alliances for co-marketing and selling, etc.). Particularly focused on wireless communications, embedded and IOT related industries (Industrial, Robotics, Retail, Banking, Hospitaility, Education, Medical, Communications, etc.). Have been doing this at Intel for 19 years and am an expert in understanding technology contract T’s&C’s, incl. fallback positions. There are 20 of us at Intel with this job role (among most senior). My skillset would translate in a smaller company to president or CEO of a startup or company that wanted to grow through partner, customer or competitor collaboration. Excited to discuss lucrative creative opportunities that may benefit my personal network or Intel. Mike Halpin,(480) 739-7291, ymike.halpin@gmail.com, mike.halpin@intel.com