Ming Li
Technical Director at Rambus
Based in Fremont, United States
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Seniority
Director
Department
Information Technology
Location
Fremont
Industry
Semiconductor Manufacturing
Company size
1.1K
Contact information
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m•••••••@rambus.com
Phone
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Background
About Ming Li
Experienced Technical Leader in Advanced IC Packaging/System-in-Package (SiP) Design, Development, Modeling/Analysis and Characterization Areas Specialties: IC/SiP packaging design, development and modeling. Thermal and mechanical modeling of IC/SiP package and its system. IC/SiP package layout. Advanced IC/SiP packaging development. IC/SiP packaging assembly management and vendor relationship, 3DIC and 2.5D Si interposer design and process development.
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