Miya Chen
製程整合工程師 at Winbond
Based in Taichung City, Taiwan
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Seniority
Staff
Department
Other
Location
Taichung City
Industry
Semiconductor Manufacturing
Company size
1.5K
Contact information
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m•••••••@winbond.com
Phone
5 credits+886 ••• •••• ••••
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Background
About Miya Chen
Experienced process & intergration engineer in semiconductor manufacturing. Familiar with semiconductor process flow, WAT / CP analysis, yield test flow, Fab operation. Experienced Senior R&D engineer with a demonstrated history working in the display industry. Skilled in thin film encapsulation, inkjet printing technology, OLED evaporation process, material development and qualification. Strong arts and design professional with two Master’s degrees in Chemistry and Material Science and Engineering.
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