Mohammad Shahabuddin
Packaging R & d Engineer at Intel Corporation
Based in United States
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Seniority
Staff
Department
Engineering
Location
United States
Industry
Semiconductor Manufacturing
Company size
110K
Contact information
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m•••••••@intel.com
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Background
About Mohammad Shahabuddin
Learner, Researcher, Packaging R&D Engineer at Intel, I contribute to the design, development, and testing of innovative packaging solutions for high-performance computing products. Passionate about engineering research and product development. I hold a Master's degree in Mechanical Engineering from Georgia Southern University, where I conducted graduate research on the development of a novel vibration isolator using magnetorheological fluids and elastomers for 3D printers. Eager to apply my knowledge, skills, and creativity to solve challenging problems. Motivated by the challenges and opportunities of applying my knowledge and skills to innovative and impactful projects.
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