Mohan Gupta

Background

About Mohan Gupta

I’m driven by a deep commitment to innovation, precision, and collaboration. My passion lies in leveraging advanced semiconductor packaging technologies to drive IC packaging evolution, streamline design workflows, and empower cross-functional teams to achieve technical and operational excellence. Every challenge is an opportunity to push boundaries and deliver results that exceed expectations. As a Senior Design Engineer and Technical Program Manager, I specialize in advanced IC packaging, 2.5D/3D integration, substrate design and routing, I/O ring and netlist planning, signal and power integrity (SIPI), and design management. I’ve successfully led complex global engineering programs, ensuring alignment between design, quality, and manufacturing for seamless, high-reliability product delivery. My technical proficiency includes Cadence Allegro Package Designer (APD), ANSYS HFSS, Q3D, and AutoCAD, supported by strong communication, problem-solving, and leadership skills. At Texas Instruments, I co-developed a strategic quoting tool that enabled cost-effective packaging solutions and supported new business acquisitions. I also hold multiple patents in circuit packaging innovation and have developed automation methodologies that reduced project cycle times and improved efficiency. I’m passionate about advancing semiconductor packaging technologies and leading teams that deliver impactful, high-quality solutions. Let’s connect to explore opportunities to innovate and collaborate in next-generation packaging and system design.