Moises Cases

Background

About Moises Cases

Recognized expert in high-performance circuit, chip and microprocessor design; electrical packaging design and integration; and highly skilled in problem identification, resolution and communication. Knowledgeable in the concepts of service science management and engineering (SSME), enterprise transformation theory, lean enterprise concepts and social network analysis. Proven leadership record in managing and supervising a team of engineers and technicians. Chaired, led and executed complex engineering development projects to their successful completion. Results-driven, self-motivated, and creative with excellent interpersonal and team building skills. Lectured in U.S, Italy, France, China, Taiwan, India, Singapore, Peru, and South Korea Specialties: Digital circuits, digital chips, microprocessors, and electronic packages design, modeling and verification. System electrical design and integration of modular and blade servers, including signal integrity (SI), power integrity (PI) and electromagnetic compliance (EMC).