Naoki Kito

Background

About Naoki Kito

1)Design and application engineering of challenging project to semiconductor packaging with Ceramic and Organic substrate.Engineering support of resolving assembly process issue. 2)Established all new manufacturing process with high speed integrated production line,equipents and raw materials for multilayer ceramic package and substrate. 3)Development of high heat dissipation substrate material using ceramic material and metal material and development of conductor layer formation technology. 4)Project management from development of various ceramic materials to mass production. Design of production equipment and inspection equipment. 5)Management for creating and realizing the HTCC technology roadmap. 6)Development project manager for high heat dissipation multi-layer ceramic packages / substrates for LED / LD customers. Creating business and marketing strategies. 7)Developed materials and processes for organic substrates, and brought about industry innovation from varnish type to film formation. 8)The technical officer for the development and mass production of HTCC ceramic packages for camera modules for major smartphone manufacturers. 9)Stationed in Southeast Asia, engaged in technical and quality support for semiconductor customers, and built an engineer network. 10)HTCC ceramic packaging technology was developed with a researcher who won the Nobel Prize in Physics, and it was put into production. 11)Build a network with new business creation companies. 12)New business proposal and realization. Plans investment for overseas ventures and realizes investment of 2 billion yen.