Niranjan Parab
Packaging Engineer at Intel Corporation
Based in Phoenix, United States
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Seniority
Staff
Department
Engineering
Location
Phoenix
Industry
Semiconductor Manufacturing
Company size
110K
Contact information
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n•••••••@intel.com
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Background
About Niranjan Parab
Aerospace engineer with more than 10 years of research experience in mechanics, manufacturing, and materials • Specialist in mechanical and materials characterization using wide array of experimental and numerical tools • Author of 35 publications in peer reviewed journals, including 10 first-author papers • Interdisciplinary collaborator with experience in working with partners in academia and private industry Complete list of publications: & hl=en
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