Nitin Uppal

Principal Engineer at Intel

Based in Tempe, United States

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Seniority

Staff

Department

Engineering

Location

Tempe

Industry

Semiconductor Manufacturing

Company size

110K

Contact information

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Email

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n•••••••@intel.com

Phone

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Background

About Nitin Uppal

I am a Principal Engineer and Group Lead at Intel Corporation with over 17 years of experience in advanced semiconductor packaging, spanning EMIB, Co-EMIB, Foveros, and 2.5D/3D integration technologies. My expertise lies in packaging reliability, design for manufacturability, and cross-functional program leadership — delivering solutions from architecture definition to high-volume manufacturing (HVM). I’m passionate about driving reliability-first design culture, data-driven decisions, and technical mentorship, ensuring products meet rigorous customer and industry standards. Focus Areas: • Advanced Packaging Reliability (HBM, EMIB, Foveros, TSV) • Design for Reliability (DFR) & Manufacturability (DFM) • Statistical Process Control (SPC), DOE, and FMEA • Quality Systems, MRB Leadership & Root Cause Analysis (8D, 5-Why) • Customer-Facing Risk Communication & Supplier Engagement I thrive at the intersection of technical depth, program execution, and business impact, bridging engineering excellence with organizational strategy.

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