Paul Gasper
Senior Equipment Engineer - Thin Films Cvd at Tsmc Washington
Based in Portland, United States
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Seniority
Staff
Department
Engineering
Location
Portland
Industry
Semiconductor Manufacturing
Company size
574
Contact information
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p•••••••@wafertech.com
Phone
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Background
About Paul Gasper
I am a recent graduate of Oregon State University driven by a strong passion for semiconductor technology. I have a master's in electrical engineering and a bachelor's in mechanical engineering. I bring hands-on experience from internships as an equipment engineer at two major semiconductor manufacturers, where I honed my troubleshooting and problem-solving skills in fast-paced, high-tech environments. I am a graduate of the MECOP program. My background includes several years in an environmental sensing lab, where I designed, built, and maintained complex electromechanical systems. Here, I also developed a foundation in embedded systems architecture and programming. I enjoy leading teams toward shared goals and take pride in my ability to think critically under pressure. Whether I am designing simple semiconductor devices for coursework or rebuilding cars in my free time, I'm always motivated to understand systems on a deeper level and develop practical, innovative improvements.
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