Verified recordResearch Services

Perceval Coudrain

Advanced Packaging & 3d Integration at Cea

Based in France

View on LinkedIn

7-day free trial · no credit card

Seniority

Staff

Department

Engineering

Location

France

Industry

Research Services

Company size

19K

Contact information

Reveal Perceval's email and phone

Direct contact data is gated. Sign up and reveal. You only pay for verified records.

Email

1 credit

p•••••••@cea.fr

Phone

5 credits

+33 ••• •••• ••••

You only pay for valid records. Bounced emails and disconnected numbers cost nothing.

Background

About Perceval Coudrain

Senior 3D Integration Engineer Strong background in multi-scale 3D integration, from transistors to packaging, with a large practical experience in advanced 3D prototyping-TSV last process for WLP of image sensors and Power Amplifiers -TSV Middle integration for face-to-face digital/analog partitionning -TSV Middle integration for face-to-back Wide I/O memory on Logic stacking -Monolithic 3D integration for advanced miniaturized CMOS pixels Expertise in thin film deposition (CVD, PVD, PLD), with 10 years of experience in CMOS / MEMS processing. Extended knowledge in miniaturized Active Pixel Sensors technologies (low noise pixels, backside illumination (BSI), Wafer Level Package (WLP)). Active participation on European/French collaborative projects (NANO2012, OSEO, FP6, ANR, Catrene). Expert for ANR project evaluation. Occasionally teaching on Advanced CMOS Image Sensors technology.

Decision-makers

Other people at Cea

Browse the Cea team →

Build a list of verified contacts at Cea

Free for 7 days · 50 credits · no card · only pay for verified records.

Start free

Reach more buyers like Perceval

250M+ professionals with verified email and phone. You only pay for records that actually verify.

7-day trial · no credit card · cancel anytime

Perceval Coudrain Email & Phone Number @ Cea | Kipplo Discover