Radha Muddu

Packaging R & d Engineer at Intel Corporation

Based in Portland, United States

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Seniority

Staff

Department

Engineering

Location

Portland

Industry

Semiconductor Manufacturing

Company size

110K

Contact information

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Email

1 credit

r•••••••@intel.com

Phone

5 credits

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Background

About Radha Muddu

I have a strong educational background with a Ph.D. in Mechanical Engineering from Texas A&M University and a Master’s from Purdue University, in the thermal-fluids area. I am an experienced Thermal and Reliability Engineer with a demonstrated history of working in the semiconductor industry at Intel Corporation. I took a career sabbatical in 2017 to raise my two young kids. It was an unexpected career move, but it was the right one for my family at that time. I came back to the workforce in 2020, once again at Intel Corporation, for my Career 2.0, working on enabling key technologies.

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