Ramakrishna Choppa

Background

About Ramakrishna Choppa

With over 13+ years of experience in Design & Development, Design Validation, and Testing of RF, microwave, and RADAR systems and subsystems, I bring a wealth of expertise to the table: • Proven ability in the Design & Development, Design Validation, and Testing of RF, Microwave, and RADAR systems, sub-modules, circuits, and components, aligned with customer objectives and requirements. • Proven Expertise in designing and simulating microwave circuits like multilayer transmission lines, via transitions, filters, power dividers, couplers, attenuators, antenna arrays and wave guides using tools such as CST Studio, HFSS, Keysight ADS, and Keysight Genesys. • Extensive experience in working with broad-band systems (DC-40GHz) and MMIC technology. • Demonstrated expertise in working end-to-end projects, encompassing block diagram design, component selection, schematic design, layout design, board testing, module and integration-level troubleshooting, subsystem integration, and installation. • Extensive experience in RF multilayer PCB layout design using ADS Layout and CADENCE. • Sound understanding of RF components/Blocks, including LNA, power amplifier, limiting amplifier, switches, diode detectors, up/down converters, transmitters/receivers, filters, IQ mixers, synthesizers, EDLVA, log video amplifiers, phase correlators, Yig-based products, isolators, circulators, and antennas. • Hands-on experience in high-speed analog circuit design using LT Spice. • Skilled in writing automation scripts for RF Test equipment using MATLAB. • Expertise in troubleshooting Signal Integrity & Power Integrity (SI/PI) issues, including timing delay, reflection, crosstalk, plane impedance, voltage drop, and EMI emission. • In-depth knowledge and utilization of test equipment such as signal generators, spectrum analyzers, network analyzers, oscilloscopes, function generators, noise sources, power meters, and logic analyzers. • Familiarity with Analog circuits like ADC/DAC, LDOs, PLLs, temperature sensors, switched-mode regulators, and Large-Scale Integration (LSI) technology. • Coordination with CAD engineers and associated teams for component placement, design, and manufacturing of PCBs and mechanical housing. • Proficient in preparing PDR, CDR, SOP, ATP, QTP, EMI/EMC, and TS Documents. • Skillful in preparing product costing data, technical presentations (PPT), and delivery schedules for projects. • Demonstrated aptitude in project development, planning and organization, budget monitoring, and cost control.