Renan Moreira
Chief Technology Officer at Ultra-Low Loss Technologies
Based in Goleta, United States
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Seniority
C-Team
Department
Information Technology
Location
Goleta
Industry
Appliances; Electrical; and Electronics Manufacturing
Company size
2
Contact information
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r•••••••@ultralowlosstechnologies.com
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Background
About Renan Moreira
I recently defended my Ph.D. at the University of California Santa Barbara where I worked in the field of integrated photonics. I have a strong background in designing, fabricating, and testing planar lightwave circuits (PLCs). At UCSB I worked with silicon nitride as an integration platform but I also have some experience in fabricating and testing Silicon and polymer (SU8) waveguide devices. The title of my Ph.D. dissertation is:"Integrated Optical Delay Line Circuits on a Ultra Low Loss Waveguide Platform." One of my many visions is the application of integrated photonics for the improvement of the healthcare system via treatment, diagnostics and point of care solutions. I was part of the UCSB team that developed a record low-loss waveguide platform through intensive material study and simulations to arrive at an optimal geometry and material for low loss waveguides. At the moment I use the low loss platform for multiple applications which include: • True-time delays for broadband phased array antennas (~12 ns of demonstrated delay) • Integrated optical gyroscope delays • Integrated 10 stages WDM dispersion equalizer (+/- 500 ps/nm @ 40 Gbit/sec) • Multi-layer integration of PLCs through vertical coupling for footprint reduction (0.25 dB per transition) I currently have 5+ years of cleanroom experience in class 100 and facilities where I develop and maintain process travelers. I have expertise in PECVD, HD-PECVD, IBD, sputter, evaporation, oxidation, and ALD. I also have experience in wet and dry etching which includes Si DRIE, ICP-RIE. Vast knowledge of metrology such as AFM, SEM, ellipsometry, confocal and optical microscopy. Lithography experience includes contact and DUV stepper (248nm); and finally, wafer bonding and dicing. Similarly, I have lab experience necessary to characterize PLCs.
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