Sebastian Hampl

Background

About Sebastian Hampl

Passionate about RF simulation, dielectric material science, and digital engineering innovation. I bring over 10 years of experience in RF technology, material database systems, and simulation methods across leading telecommunications projects. As a technical project lead, I have successfully initiated and driven cross-functional innovation projects, including the implementation of a company-wide dielectric material database and the setup of a dielectric material characterization lab. My work bridges R&D and product validation through advanced EMC/PIM simulations, thermal modeling, and digital twin solutions. I’m deeply involved in developing simulation methodologies, optimizing material extraction processes, and ensuring accurate characterization for RF and microwave components. My work has helped shape next-gen mobile networks through efficient PIM modeling and material simulation tools Highlights-Project lead and initiator of the “Common Material Database” to improve simulation accuracy and material data traceability across business units -Technical lead and implementation of the dielectric material characterization lab (FR1) – from concept to full operational capability -Development of simulation methods for EMC/PIM analysis, thermal and mechanical behavior Key contributor to Digital Twin initiatives, linking material data and simulation systems for next-gen product development -Strong internal networker enabling cross-functional collaboration and knowledge transfer throughout the organization