Singda Jiang
Package & Simulation Engineer at Tsmc
Based in Taiwan
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Seniority
Staff
Department
Other
Location
Taiwan
Industry
Semiconductor Manufacturing
Company size
25K
Contact information
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s•••••••@tsmc.com
Phone
5 credits+886 ••• •••• ••••
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Background
About Singda Jiang
High performance computing (HPC) package on-board reliability and package-to-system interaction- Mechanical/Thermal simulation of 2.5D/3D IC package for component/board level reliability and design of experiment (DOE) risk assessment- Co-work with outsourcing partners for post-reliability physical FA and package on-board SMT (stencil design, tooling preparation, and reflow profile tuning)- Hands-on experience of implementing thermal solutions such as thermal interface material (TIM), heatsink, stiffener, and fan module assembly.
Decision-makers
Other people at Tsmc
- GCStaff
Grace Chu
製程 製造管理 · Other
- DLManager
David Li
Manufacturing Section Manager · Manufacturing & Production
- DEDirector
David Esteban Maldonado Flores
Director of Senior Technical Recruitment · Human Resources
- MCDirector
Madison Clark
Director of Senior Technical Recruitment · Human Resources
- ACManager
Adam Chen
Sr Manager · Manufacturing & Production
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