Sivareddy Dondeti
Packaging Module Development Engineer at Intel
Based in Chandler, United States
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Seniority
Staff
Department
Engineering
Location
Chandler
Industry
Semiconductor Manufacturing
Company size
110K
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s•••••••@intel.com
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Background
About Sivareddy Dondeti
Ph.D. candidate with 5 years of research experience in solid mechanics, experimental mechanics, fracture mechanics- More than 8 years of industrial experience as Structural Analysis Engineer- Involved in product development from Conceptual Design to Certification- Experimental characterization of materials under static and dynamic conditions- Developed hybrid experimental-FEA simulation models for material characterization- Strong fundamental knowledge in solid mechanics and classical hand calculations - Extensively experienced in Finite Element Analysis using Abaqus, Patran, Nastran, HyperMesh, Ansys- Developed complex numerical models using MATLAB to evaluate fracture parameters- Working knowledge of SolidWorks, CATIA, unigraphics.
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