Soham Shah

Wafer Assembly Technology Development Engineer at Intel Corporation

Based in Hillsboro, United States

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Seniority

Staff

Department

Engineering

Location

Hillsboro

Industry

Semiconductor Manufacturing

Company size

110K

Contact information

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Email

1 credit

s•••••••@intel.com

Phone

5 credits

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Background

About Soham Shah

I am currently a Module Development Engineer at Intel, developing processes for Hybrid Bonding and Overlay Metrology in support of high-volume manufacturing for Intel’s Foveros Direct advanced packaging. I collaborate extensively with engineers from other modules, leading equipment ownership, analyzing data, and troubleshooting to improve process stability and throughput. Previously, I earned a Ph.D. from UC Riverside, focusing on materials development and characterization for heterogeneous catalysis, and completed an internship at Lawrence Livermore National Laboratory. My experience has equipped me with strong skills in statistical process control, design of experiments, and technical communication. My managers and colleagues have described me as a hard-working and curious team player and an amicable presence. I am interested in roles in process engineering, materials development or catalysis Drop a message if you have any job opportunities, for questions about my research or just to say hi! Also check out my work here: Abdul-Aziz Lab website: Google Scholar: https://bit.ly/3M3NICP

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