Stan Ling
Engineering Director, Customer Programs at Intel Corporation
Based in Granite Bay, United States
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Seniority
Director
Department
Engineering
Location
Granite Bay
Industry
Semiconductor Manufacturing
Company size
110K
Contact information
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s•••••••@intel.com
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Background
About Stan Ling
A technical program manager with a proven track record of delivering complex, high-profile projects on-time to meet high-volume sales targets. More than 20 years of experience as both a systems engineer and program manager. Over the last 5 years, I have been part of the core team to launch several products with THE iconic brand, establishing a billion-dollar business. Share of volume was increased year-by-year by demonstrating strong capability to support multiple simultaneous designs. My past experience has provided a lasting knowledge base enabling me to comprehend and effectively manage the complex technical issues ensuring effective solutions to secure the project's success TECHNICAL PROGRAM MANAGEMENT · Product commercialization through full project lifecycle (requirements through post-launch). · Management of both HW (silicon & board level) and SW projects. · Schedule and resource planning, solution deployment, defect management, etc. · SW release management, including release strategy, release planning, content, and release criteria. · Actively drive complex, cross-domain (HW/SW, across chips, analog/digital, RF/baseband, etc.) features and defects. · Project status communications to internal and external stakeholders, at both engineering and management-levels. PROCESS DEVELOPMENT · Establish processes for providing customer support through the entire project lifecycle. CROSS-ORGANIZATION/SITE MANAGEMENT · Deliver within multi-geo development structure (US, EU, China, India), with active handovers for critical issues. SYSTEM ENGINEERING · Expertise in wireless/wireline communications systems - hardware, RF performance, RF/DSP demodulator architectures, receiver architectures, modulation schemes. · Presented proposals to standards bodies 3GPP, T1E1).
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