Stanley Hou

Mts Physical Design Engineer at Qualcomm

Based in United States

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Seniority

Staff

Department

Other

Location

United States

Industry

Semiconductor Manufacturing

Company size

53K

Contact information

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Email

1 credit

s•••••••@qualcomm.com

Phone

5 credits

+1 ••• •••• ••••

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Background

About Stanley Hou

More than 13 yeas of ASIC Physical Design experience with deep submicro process like 28nm, 20nm, 16nm, 12nm and 7 nm. Familar with the whole flow from RTL to GDSII, including Synthesis, DFT insertion, floorplan/budgeting, APR and Sign-off checks especially expertised in power signoff and STA. Proficient in script compiling including Python, Perl, TCL and Unix Shell. Proficient in kinds of EDA tools including SNPS DC, ICC, ICC2, PT and PTPX and Cadence Genus, innovus, as well as Redhawk signoff.

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