Steven Wan
Director Unit Process Development at Infineon Technologies
Based in Seremban, Malaysia
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Seniority
Director
Department
Other
Location
Seremban
Industry
Semiconductor Manufacturing
Company size
43K
Contact information
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s•••••••@infineon.com
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Background
About Steven Wan
A highly experienced Process Package Development Engineering (NPD) and Equipment with 20 years of experience in managing highly successful process package development and managing project requirements with stakeholders. Proven in boosting efficiency, delivering projects on budget, and driving continuous improvement. Strong communication, DOE-JMP, problem-solving, decision-making, and building stakeholder relationships. Experts in various bonding techniques including die bonding, CIS glass bonding, clip bonding, multichip bonding, soft solder bonding, flip chip, and eutectic bonding. Skilled in ultra-thin die, stack die, multi-die, Ag sintering, DAF/c-DAF, WBC, solder paste, epoxy paste, UV glue, and more. Proficient in developing die attach, CIS process materials and lead frame design, ensuring manufacturability, quality, and cost-efficiency.
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