Suny Li

Background

About Suny Li

I am a nice guy with strong responsibility and industry. Have more than 23 years' work experience and knowledge including 15 year’s Application Engineer experience, especially for SiP/Advanced Package/PCB design and simulation. 7 years' experience and knowledge in Hardware design (HW system design, Layout, SI/PI simulation and EMI etc.), 1.5 year’s Product Engineer in MSA (Multi-Physics Systems Analysis) software. I am a team player and have high level of communication and interpersonal skills. Be self-motivated, be strong ability of self-culture, and willing to share knowledge and experience with team members, be willing to take on challenging tasks independently, can fulfill high efficiency and quality work. During my work as SiP Technical specialist, I drove key customer engagements in cooperation with R&D team, to drive and influence product development to fulfill customer requirements, guided and tracked customer projects and issues. I have participated and guided customers for more than 40 key projects of SiP/Package design and simulation in China. I am also a product director in charge of the New Products R&D based on SiP and Advanced Packaging technology, have developed two Aerospace Grade SiP products in China. Based on all these projects and my work experiences, I have published 4 technical books, more than 10 Papers and 60 tech articles, gotten 10 patents. Because of the Extraordinary ability in SiP and Advanced Packaging technology, I got the First Preference visa, then I came to silicon valley to look for new possibility of my career development.