Teppo Aapro
Component Platform Specialist at Murata
Based in Vantaa, Finland
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Seniority
Staff
Department
Engineering
Location
Vantaa
Industry
Appliances; Electrical; and Electronics Manufacturing
Company size
7.1K
Contact information
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t•••••••@murata.com
Phone
5 credits+358 ••• •••• ••••
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Background
About Teppo Aapro
I have 20 years of experience in electronics R&D, 3D simulations, product thermal design and testing in global high-technology companies. I have worked in multidisciplinary design teams doing simulation-based thermal design concurrently with mechanics, HW, SW, RF, EMC & antenna, reliability and IC packaging technology leads for finding the best solutions for products. I have a strong knowledge of thermal research and technology development, IC packaging, and electronics technologies from silicon to system level. I also have a long experience of collaboration with global technology suppliers, subcontractors, and R&D-partners. Successful designs include several products. I have two granted patents and two patent applications.
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