Thomas Koschmieder

Background

About Thomas Koschmieder

Broad experience with component reliability testing and approval for safety critical modules like airbag deployment. Broad experience with automotive field mission profiles including autonomous vehicle modules and electric vehicle modules including battery charging. Leading an Automotive Electronics Council (AEC) task to create an AEC test methodology for board-level reliability. Extensive experience with mechanical reliability testing and improvement of semiconductor electronic package solder-joints. This includes mechanical tests of temperature cycling, vibration, drop, shock and bend. Experience with industry-standard tests as well those tailored to customers’ unique needs. Example successful projects are the Pb-free alloy solder conversion and 0.30 mm Pitch BGA WL-CSP qualification. The team effort to bring in house, board-level reliability testing, has now provided significant cost savings and also significant response time reductions. Uses failure analysis to understand mechanical testing results with techniques including SEM, acoustic microscopy (C-SAM), cross-section, and EDS. As an expert user of C-SAM machines and interpreter of C-SAM images, analysis of field failures for delamination is a regular activity. Extensive experience providing results to internal and external customers, either as presentations or written documents. Repeatedly a mentor for interns and their projects are still in use. Provides statistical analysis using JMP software, including design of experiment methodologies. As an example the electromigration experiment data analysis resulted in fits to the basic equation and will allow experiment based predictions for future products.