Tim Denison Freng

Background

About Tim Denison Freng

Tim has a proven track-record in developing and translating technologies for medical devices. He specializes in bioengineering technology with an emphasis on sensors, interface electronics, and control algorithms. Prior to joining Oxford, he was the Vice President of Research and Core Technology, Implantables R&D, for the Restorative Therapies Group of Medtronic. He was named a technical fellow in 2010, received Medtronic's highest technical and scientific award, membership in the Bakken Society, in 2012, and the Wallin Leadership award in 2014. Tim was recently named to the College of Fellows for the American Institute of Medical and Biological Engineering. Prior to joining Medtronic, he worked as a Senior Design Engineer with the Micromachined Products Division at Analog Devices.Outside of work, he is a frequent academic guest lecturer on neural engineering circuit designs and applications. He also served as an associate editor of the Transactions on Biomedical Circuits and Systems, an associate editor of the Transactions on Biomedical Engineering, and sits on the editorial board of the Journal of Neural Engineering. Tim served on the program committee for the International Solid-State Circuits Conference (Imagers, MEMS, Medical and Displays) from 2008-2011.Tim Denison received his S.M. and Ph.D. in Electrical Engineering from the Massachusetts Institute of Technology, and his A.B. in Physics from the University of Chicago. After a hiatus, he returned to school to finish the Executive MBA program at Booth, the University of Chicago, where he was named a Wallman Scholar.Specialties: Bioelectronic Medicines, Neuroengineering, Analog and Mixed-Signal Integrated Circuit Design, Control Systems, Medical Electronics and Systems, Technology Development in Regulated Industries, Functional and Program Management.