Tom Strothmann
Vice President North America Sales and Customer Support at Besi Netherlands B.V
Based in Chandler, United States
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Seniority
Vp
Department
Sales & Business Development
Location
Chandler
Industry
Semiconductor Manufacturing
Company size
411
Contact information
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t•••••••@besi.com
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Background
About Tom Strothmann
Semiconductor packaging expert with >20 years of experience in flip chip bumping, Wafer Level Chip Scale Packaging, Fan-Out technologies and Advanced Packaging. Extensive experience in Technical Marketing, Business Development, licensing and technology transfer, process optimization, contract negotiation, and business startup. Specialties: WLCSP and FO-WLP manufacturing technology, 3 patents issued for Fan-Out technology, Business Devlopment for WLCSP and Fan-Out services and manufacturing technology.
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