Wayne Chen
Sr Director of Qr Division at Richtek
Based in Hsinchu County, Taiwan
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Seniority
Director
Department
Other
Location
Hsinchu County
Industry
Semiconductor Manufacturing
Company size
869
Contact information
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w•••••••@richtek.com
Phone
5 credits+886 ••• •••• ••••
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Background
About Wayne Chen
Experienced NAND Flash Controller & Power IC Quality Management with a proven track record in structuring QRA organizations- Collaborating with stakeholders, managing supply chains, and implementing tailored automotive quality systems- Skilled in driving product quality, ensuring compliance with automotive requirements, and facilitating successful production ramp-up- Developed tailored automotive quality systems for IC design houses and facilitated successful customer audits- Lead failure analysis and complaint handling, implementing corrective actions to enhance product quality- Implemented continuous improvement initiatives, fostering a quality-focused culture, and driving operational excellence. At Siliconmotion (Nasdaq list as SIMO), Director of QRA Dept- Structure QRA organization to be tier 1 product quality and reliability including wafer, package, SiP and module- Work in partnership with customers, R&D teams and engineering teams on NPI, audit, issues, failure analysis & automotive requirement involvement- Manage supply chain to ensure yield goals, product quality, issues impacting & automotive requirement- Tailor-made automotive quality system for IC design house to meet automotive production ramp up and customer audit. At PixArt Image Inc. Dept Manager of QRA - Manage company quality system & policy, through DQA, VQA, MQA & SSQA systematic approach- Drive continuous improvement of subcon process & quality KPI - Engage & qualify several subcon to meet newly merge company needed demand At ASE, Dept. Manager - Strategically "Turn Key" model operation between ASE and TSMC in flip chip and SiP joint vendor factory. Focus on cutting edge technology development- A solution provider of 90nm/65nm/45nm/28nm flip chip technology with value added for wafer, package and SiP- Flip chip bumping technology, joined 12" bumping line setup - Flip chip assembly technology, setup 2 flip chip assembly lines, experienced process engineering management & manufacturing management. At Philips Display, Section manager - Well trained thermal & physics field under Philips engineering system at Eindhoven- 2 times PQA (Philips Quality Award)- Asia region representative - Experienced process engineering, R&D dept.
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